Advisory Committee
Juyang (John) Weng, Michigan State University, USA (IEEE Fellow)
Giulio Sandini, Italian Institute of Technology, Italy (IEEE Senior Member)
Conference Chair
Xie Ming, Nanyang Technological University, Singapore
Conference Co-Chair
Wei-Hsin Liao, The Chinese University of Hong Kong, Hong Kong (IEEE Senior Member)
Program Chairs
Marcelo Ang, National University of Singapore (NUS), Singapore (IEEE Senior Member)
Jianbo Su, Shanghai Jiao Tong University, China (IEEE Senior Member)
Yanxia Sun, University of Johannesburg, South Africa (IEEE Member)
Tomas Krajnik, Czech Technical University in Prague, Czechia (IEEE Senior Member)
Program Co-chairs
Chi-Hua Chen, Telecommunication Laboratories, Chunghwa Telecom Co., Ltd. (IEEE Senior Member)
Mu-Chun Su, National Central University, Taiwan (IEEE Senior Member)
Qingchuan Ma, Beihang University, China
Publication Chair
Jamaludin Jalani, Universiti Tun Hussein Onn Malaysia, Malaysia (IEEE Member)
Publicity Chairs
Sharmila. B, Sri Ramakrishna Engineering College, India (IEEE Member)
Xiaojun Wu, Jiangnan University, China (IEEE Member)
International Technical Committee
Afaq Ahmed, Sultan Qaboos University, Oman
Attila Kertesz, University of Szeged, Hungary
Binoy Krishna Roy, National Institute of Technology, Silchar, India
Bishakh Bhattacharya, Indian Institute of Technology Kanpur, India
B. K. Rout, Birla Institute of Technology and Science Pilani, Pilani Campus, India
Christos Volos, Aristotle University of Thessaloniki, Greece
Dang Ngoc Hoang Thanh, University of Economics Ho-Chi-Minh city, Vietnam
Giseo Park, University of Ulsan, Korea
Hongliang Ren, National University of Singapore, Singapore
Juan Manuel Corchado, University of Salamanca, Spain
Laribi Med Amine, University of Poitiers, France
M. Nagarajapandian, Sri Ramakrishna Engineering College, Coimbatore, India
Masashi Sugano, Osaka Prefecture University, Japan
Maurizio Marchese, University of Trento, Italy
Nico Surantha, Tokyo City University, Japan
Ong Pauline, Universiti Tun Hussein Onn Malaysia, Malaysia
Pak Kin Wong, University of Macau, China
Qing Tan, Athabasca University, Canada
Qingzhong Liu, Sam Houston State University, USA
Rohit Thanki, Krian GmbH Wolfsburg, Germany
Sawat Pararach, Thammasat University, Thailand
Seokcheon Lee, Purdue University, USA
Tan Tse Guan, Universiti Malaysia Kelantan (UMK), Malaysia
Valentina Donzella, University of Warwick, UK
Wuttinan Nunkaew, Thammasat University, Thailand
Y. Dharshan, Sri Ramakrishna Engineering College, Coimbatore, India
Yilun Shang, Northumbria University, UK
Yu-Sheng Lu, National Taiwan Normal University, Taiwan